3

QLSP04XXU-XXX Color LED V1.1

Recommended Solder footprint:

* All dimensions are in millimeters.

* The LEDs is designed to be reflow soldered on to a PCB. IF dip soldered that QL cannot guarantee its

reliability.

* Reflow soldering must not be performed more than twice.

Characteristics

◼ Absolute Maximum Ratings

(Ta=25℃)

Parameter

Symbol

Rating

Unit

DC Forward Current

If

700

mA

Leakage Current

Ir

1.0

μA

Power Dissipation

Pd

2.3

W

Pulse Forward Current

Ifp

1000

mA

LED Junction Temperature

TJ

125

℃

Storage Temperature

Tstg

-40 ~ 100

℃

Operation Temperature

Topr

-40 ~ 85

℃

Soldering Temperature

Tsol

260 < 10 sec

℃

ESD Sensitivity(HBM)

8

KV

Thermal Resistance

Rth

10

℃W

(1) Proper current rating must be observed to maintain junction temperature below maximum at all time

(2) IFP Condition: Duty 1/10, Pulse within 10msec