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PB51 Datasheet(PDF) 1 Page - Cirrus Logic

Part # PB51
Description  POWER OPERATIONAL AMPLIFIER
PDF  4 Pages
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Manufacturer  APEX [Cirrus Logic]
Direct Link  http://www.cirrus.com
Logo APEX - Cirrus Logic

PB51 Datasheet(HTML) 1 Page - Cirrus Logic

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APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
1
FEATURES
• WIDE SUPPLY RANGE — ±15V to ±150V
• HIGH OUTPUT CURRENT —
1.5A Continuous (PB51), 2.0A Continuous (PB51A)
• VOLTAGE AND CURRENT GAIN
• HIGH SLEW —
50V/µs Minimum (PB51)
75V/µs Minimum (PB51A)
• PROGRAMMABLE OUTPUT CURRENT LIMIT
• HIGH POWER BANDWIDTH — 320 kHz Minimum
• LOW QUIESCENT CURRENT — 12mA Typical
• EVALUATION KIT — EK29
APPLICATIONS
• HIGH VOLTAGE INSTRUMENTATION
• ELECTROSTATIC TRANSDUCERS & DEFLECTION
• PROGRAMMABLE POWER SUPPLIES UP TO 280V P-P
DESCRIPTION
The PB51 is a high voltage, high current amplifier designed
to provide voltage and current gain for a small signal, general
purpose op amp. Including the power booster within the feed-
back loop of the driver amplifier results in a composite amplifier
with the accuracy of the driver and the extended output voltage
range and current capability of the booster. The PB51 can also
be used without a driver in some applications, requiring only
an external current limit resistor to function properly.
The output stage utilizes complementary MOSFETs, pro-
viding symmetrical output impedance and eliminating second
breakdown limitations imposed by Bipolar Transistors. Internal
feedback and gainset resistors are provided for a pin-strapable
gain of 3. Additional gain can be achieved with a single external
resistor. Compensation is not required for most driver/gain
configurations, but can be accomplished with a single external
capacitor. Enormous flexibility is provided through the choice
of driver amplifier, current limit, supply voltage, voltage gain,
and compensation.
This hybrid circuit utilizes a beryllia (BeO) substrate, thick
film resistors, ceramic capacitors and semiconductor chips to
maximize reliability, minimize size and give top performance.
Ultrasonically bonded aluminum wires provide reliable inter-
connections at all operating temperatures. The 12-pin Power
SIP package is electrically isolated.
TYPICAL APPLICATION
EQUIVALENT SCHEMATIC
EXTERNAL CONNECTIONS
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12-PIN SIP
PACKAGE STYLE DP
Formed leads available. See package styles ED & EE


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