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ESDL2012 Datasheet(PDF) 6 Page - ON Semiconductor |
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ESDL2012 Datasheet(HTML) 6 Page - ON Semiconductor |
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6 / 7 page ![]() ESDL2012 www.onsemi.com 6 PACKAGE DIMENSIONS DFN2, 0.60x0.30, 0.36P CASE 152AX ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. A B E D BOTTOM VIEW b L TOP VIEW A A1 C SEATING PLANE SIDE VIEW DIM MIN NOM MILLIMETERS A 0.175 0.200 A1 b 0.205 0.215 D E SOLDER FOOTPRINT* DIMENSIONS: MILLIMETERS 0.65 0.27 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 1 L 0.145 0.155 0.26 RECOMMENDED 1 e 0.36 BSC A M 0.05 B C A M 0.05 B C 2X e 2X 2X 0.01 C 0.02 C 0.575 0.600 0.275 0.300 PIN 1 INDICATOR MAX 0.225 0.225 0.165 0.625 0.325 0.018 REF |
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