Pad Name

I/O

Internal

Connection

Function

VDDA

¾¾

DAC power supply

VSSA

¾¾

Negative power supply of DAC, ground

OSC1

OSC2

I

O

¾

OSC1 and OSC2 are connected to an RC network or a crystal (by mask

option) for the internal system clock. In the case of RC operation, OSC2 is

the output terminal for 1/8 system clock. The system clock may come from

the crystal, the two pins cannot be floating.

GND

¾¾

Negative power supply, ground

VDD

¾¾

Positive power supply

RES

I

¾

Reset input, active low

MIDI_OUT

O

¾

MIDI Output

MIDI_THRN

O

¾

MIDI through

MIDI_IN

I

¾

MIDI input

Absolute Maximum Ratings

Storage Temperature ...........................

-50°Cto125°C

Operating Temperature ..........................

-25°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

D.C. Characteristics

Ta=25

°C

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Conditions

Operating Voltage

¾¾

3.6

4.5

5.5

V

Operating Current

4.5V

No load,

¾

16

32

mA

Standby Current (WDT Disabled)

4.5V

No load,

System HALT

¾

13

mA

I/O Ports Source Current

4.5V

5

¾¾

mA

I/O Ports Sink Current

4.5V

5

¾¾

mA

Input High Voltage for I/O Ports

4.5V

¾

¾

V

Input Low Voltage for I/O Ports

4.5V

¾

0

¾

V

Pull-High Resistance of I/O Ports (INT) 4.5V

¾

30

¾

k

W

HT36B0

Rev. 1.00

5

June 30, 2003