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IRF9640L Datasheet(PDF) 2 Page - Vishay Siliconix |
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IRF9640L Datasheet(HTML) 2 Page - Vishay Siliconix |
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2 / 10 page ![]() IRF9640S, SiHF9640S, IRF9640L, SiHF9640L www.vishay.com Vishay Siliconix S21-0904-Rev. F, 30-Aug-2021 2 Document Number: 91087 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Note a. When mounted on 1" square PCB (FR-4 or G-10 material) Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11) b. Pulse width ≤ 300 μs; duty cycle ≤ 2 % THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP. MAX. UNIT Maximum Junction-to-Ambient RthJA -62 °C/W Maximum Junction-to-Ambient (PCB mount) a RthJA -40 Maximum Junction-to-Case (Drain) RthJC -1.0 SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = -250 μA -200 - - V VDS Temperature Coefficient ΔVDS/TJ Reference to 25 °C, ID = -1 mA - -0.20 - V/°C Gate-Source Threshold Voltage VGS(th) VDS = VGS, ID = -250 μA -2.0 - -4.0 V Gate-Source Leakage IGSS VGS = ± 20 V - - ± 100 nA Zero Gate Voltage Drain Current IDSS VDS = -200 V, VGS = 0 V - - -100 μA VDS = -160 V, VGS = 0 V, TJ = 125 °C - - -500 Drain-Source On-State Resistance RDS(on) VGS = -10 V ID = 6.6 A b - - 0.50 Ω Forward Transconductance gfs VDS = -50 V, ID = -6.6 A b 4.1 - - S Dynamic Input Capacitance Ciss VGS = 0 V, VDS = -25 V, f = 1.0 MHz, see fig. 5 - 1200 - pF Output Capacitance Coss - 370 - Reverse Transfer Capacitance Crss -81 - Total Gate Charge Qg VGS = -10 V ID = -11 A, VDS = -160 V, see fig. 6 and 13 b -- 44 nC Gate-Source Charge Qgs -- 7.1 Gate-Drain Charge Qgd -- 27 Turn-On Delay Time td(on) VDD = -100 V, ID = -11 A, Rg = 9.1 Ω, RD = 8.6 Ω, see fig. 10 b -14 - ns Rise Time tr -43 - Turn-Off Delay Time td(off) -39 - Fall Time tf -38 - Internal Drain Inductance LD Between lead, 6 mm (0.25") from package and center of die contact -4.5 - nH Internal Source Inductance LS -7.5 - Gate Input Resistance Rg f = 1 MHz, open drain 0.3 - 1.7 Ω Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current IS MOSFET symbol showing the integral reverse p -n junction diode -- -11 A Pulsed Diode Forward Current a ISM -- -44 Body Diode Voltage VSD TJ = 25 °C, IS = -11 A, VGS = 0 V b -- -5.0 V Body Diode Reverse Recovery Time trr TJ = 25 °C, IF = -11 A, dI/dt = 100 A/μs b - 250 300 ns Body Diode Reverse Recovery Charge Qrr -2.9 3.6 μC Forward Turn-On Time ton Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD) D S G S D G |
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