FCHP

www.vishay.com

Vishay Dale Thin Film

Revision: 06-Sep-2021

4

Document Number: 60162

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Note



Thermal imaging and load life testing conducted by mounting device to a 1.6" x 3.7" test card with 3.5 mil copper plating on both sides.



Thermal vias on 50 mil centers were utilized for heat transfer between surfaces

INTERNAL IMPEDANCE

SINGLE PULSE LOAD TESTING

10

100

1000

10000

0

0.5

1.0

1.5

2.0

2.5

0.01

0.1

1

10

100

Axis Title

Frequency (GHz)

▬▬▬

Wraparound, 50 Ω

▬▬▬

Wraparound, 100 Ω

▬▬▬

Flip chip, 50 Ω

▬▬▬

Flip chip, 100 Ω

10

100

1000

10000

0.1

1

10

100

1000

0.0001

0.001

0.01

0.1

1

10

Axis Title

Pulse Duration (s)

▬▬▬

Wraparound, 50 Ω

▬▬▬

Flip chip, 50 Ω

▬▬▬

Wraparound, 100 Ω

▬▬▬

Flip chip, 100 Ω

VSWR

10

100

1000

10000

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.3

2.4

2.5

02468

10 12 14 16 18 20

Axis Title

Frequency (GHz)

▬▬▬

Wraparound, 50 Ω

▬▬▬

Wraparound, 100 Ω

▬▬▬

Flip chip, 50 Ω

▬▬▬

Flip chip, 100 Ω

10

100

1000

10000

0

1

2

3

4

5

6

7

70

150

200

Axis Title

Temperature (°C)

▬▬▬

Wraparound, 50 Ω

▬▬▬

Flip chip, 50 Ω

▬▬▬

Wraparound, 100 Ω

▬▬▬

Flip chip, 100 Ω

DERATING

10

100

1000

10000

0

20

40

60

80

100

0

20406080

140

Axis Title

Ambient Temperature (°C)

125

100

155