F1385 Datasheet

© 2022 Renesas Electronics Corporation

39

February 7, 2022

Package Outline Drawings

The package outline drawings are located at the end of this document and are accessible from the Renesas website (see Ordering

Information for POD links). The package information is the most current data available and is subject to change without revision of this

document.

Ordering Information

Orderable Part Number

Package

MSL Rating

Shipping Packaging

Temperature

F1385NBGI

6 x 6 x 0.75 mm 36-VFQFPN

MSL1

Tray

-40 °C to +105 °C

F1385NBGI8

6 x 6 x 0.75 mm 36-VFQFPN

MSL1

Tape and Reel

-40 °C to +105 °C

F1385EVBI

Evaluation Board

-40 °C to +105 °C

F1385EVS

Evaluation Board with Controller

-40 °C to +105 °C

Marking Diagram

IDTF1358

NBGI

ZB1504G

Q44B029MY

IDTF1385

NBGI

ZA1543G

Q414C131MY

1. Line 1 and 2 are the part number.

2. Line 3 - “ZA” are ASM Test Step.

3. Line 3 - “1537” is the Date Code YYWW.

4. Line 3 - “G” Assembler Code.

5. Line 4 – “Q414C131MY” Assembly Lot Code.

Revision History

Revision Date

Description of Change

February 7, 2022

Rebranded to Renesas.

August 16, 2016

Updated spec table, Typ-Ops plots per new device stepping ZA with improved image rejection

October 23, 2015

Production Release