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PARAMETER

SYMBOL

UNIT

SS82

SS84

SS86

SS810

SS815

SS820

Thermal

Resistance

Between junction and ambient

℃

/W

Between junction and lead

2

Note (1)

Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.6" x 0.6" (16 mm x 16 mm) copper pad areas

PREFERED P/N

PACKAGE

CODE

UNIT WEIGHT(g)

MINIMUM

PACKAGE(pcs)

INNER BOX

QUANTITY(pcs)

OUTER CARTON

QUANTITY(pcs)

DELIVERY

MODE

SS82~SS820

F1

Approximate 0.254

3000

6000

42000

13” reel

■

Characteristics (Typical)

0.1

0.3

TJ=25℃

Pulse width=300us

1% Duty Cycle

1.0

10

100

0.4

0.5

0.6

0.7

0.8

SS82

SS84

SS86

SS810

SS815-SS820

0.9

1.0

Instantaneous Forward Voltage (V)

FIG.3: Forward Voltage

0

0

5

1

0

5

Resistive or Inductive LoadP.C.B.

Mounted on

0.6"×0.6"(16mm×16mm)Copper Pad

Areas

100

12.0

0

25

75

125

10.0

8.0

6.0

2.0

4.0

Lead Temperature (℃)

FIG.1: Io-TL Curve

8.3ms Single Half Sine Wave

JEDEC Method

1

2

10

20

100

0

200

160

120

80

40

Number of Cycles

FIG.2: Forward Surge Current Capability

Tj=25℃

Tj=100℃

0.001

0.01

0

20

40

60

80

100

0.1

1.0

10

100

SS810-SS820

SS86

SS82-SS84

FIG.4: Typical Reverse Characteristics

Percent of Rated Peak Reverse Voltage (%)

SAM YANG

SS82-SS820

SAMYANG ELECTRONICS