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(0.80 mm) .0315"
QSFP8, QSFPC-PF, QSFPK-PF SERIES
QSFPC–PF–02
QSFP8–038–01–L–D–RA1
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
CARD
THICKNESS
NO. OF
POSITIONS
PLATING
QSFP8
RA1
D
–038
= Total Number of Positions
–01
= (1.00 mm) .039"
thick card
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSFP8
Insulator Material:
LCP
Contact Material:
Phosphor Bronze
Ground Plane:
Phosphor Bronze
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
Current Rating (QSFP8/Card):
1.6 A per pin
(2 pins powered)
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
QSFP CONNECTOR & CAGE
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
For complete specifications see
www.samtec.com?QSFPC-PF or
www.samtec.com?QSFPK-PF
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
TYPE
TERMINATION
OPTION
QSFPC
= Cage
QSFPK
= Cage and Connector Kit
–PF
= Press-fit
SPECIFICATIONS
SPECIFICATIONS
(20.76)
.817
(19.94)
.785
(11.91)
.469
(58.80) 2.315
(7.20)
.283
(45.65) 1.797
Heat Sink
(18.20) .717
(1.40)
.055
DIA
(1.40)
.055
(1.10) .043
(14.40)
.567
(0.80)
.0315
BOTTOM VIEW
–02 SHOWN
–01
= Without Heat Sink
–02
= With Heat Sink
–03
= With Heat Sink and
clip packaged separately
(Recommended for
cage press-fit processing)
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
FILE NO. E111594
F-218 (Rev 29MAR18)
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