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HT86070 Datasheet(PDF) 5 Page - Holtek Semiconductor Inc

Part # HT86070
Description  Voice Synthesizer 8-Bit MCU
PDF  25 Pages
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Manufacturer  HOLTEK [Holtek Semiconductor Inc]
Direct Link  http://www.holtek.com
Logo HOLTEK - Holtek Semiconductor Inc

HT86070 Datasheet(HTML) 5 Page - Holtek Semiconductor Inc

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Pad Description
Pad Name
I/O
Mask Option
Description
PA0~PA7
I/O
Wake-up,
Pull-high
or None
Bidirectional 8-bit I/O port. Each bit can be configured as a wake-up input
by mask option. Software instructions determine the CMOS output or
Schmitt trigger input with or without pull-high resistor (mask option).
PB0~PB7
I/O
Pull-high
or None
Bidirectional 8-bit I/O port. Software instructions determine the CMOS
output or Schmitt trigger input (pull-high resistor depending on mask op-
tion).
VSS
¾¾
Negative power supply, ground
VDD
¾¾
Positive power supply
VDDA
¾¾
DAC power supply
VSSA
¾¾
DAC negative power supply, ground
RES
I
¾
Schmitt trigger reset input, active low
INT
I
Falling Edge Trigger
or Falling/Rising Edge
Trigger
External interrupt Schmitt trigger input without pull-high resistor. Choice
falling edge trigger or falling/rising edge trigger by mask option. Falling
edge triggered active on a high to low transition. Rising edge triggered
active on a low to high transition.
OSC1
OSC2
¾
RC or Crystal
OSC1 and OSC2 are connected to an RC network or a crystal (by mask
option) for the internal system clock. In the case of RC operation, OSC2
is the output terminal for 1/4 system clock.
The system clock may come from the crystal, the two pins cannot be
floating.
AUD
O
¾
Audio output for driving a external transistor or for driving HT82V733
Absolute Maximum Ratings
Supply Voltage ..........................VSS
-0.3V to VSS+5.5V
Storage Temperature ...........................
-50°Cto125°C
Input Voltage .............................VSS
-0.3V to VDD+0.3V
Operating Temperature ..........................
-20°Cto70°C
Note: These are stress ratings only. Stresses exceeding the range specified under
²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
HT86030/HT86070
Rev. 1.00
5
February 20, 2006



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