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HT86070 Datasheet(PDF) 5 Page - Holtek Semiconductor Inc |
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HT86070 Datasheet(HTML) 5 Page - Holtek Semiconductor Inc |
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5 / 25 page ![]() Pad Description Pad Name I/O Mask Option Description PA0~PA7 I/O Wake-up, Pull-high or None Bidirectional 8-bit I/O port. Each bit can be configured as a wake-up input by mask option. Software instructions determine the CMOS output or Schmitt trigger input with or without pull-high resistor (mask option). PB0~PB7 I/O Pull-high or None Bidirectional 8-bit I/O port. Software instructions determine the CMOS output or Schmitt trigger input (pull-high resistor depending on mask op- tion). VSS ¾¾ Negative power supply, ground VDD ¾¾ Positive power supply VDDA ¾¾ DAC power supply VSSA ¾¾ DAC negative power supply, ground RES I ¾ Schmitt trigger reset input, active low INT I Falling Edge Trigger or Falling/Rising Edge Trigger External interrupt Schmitt trigger input without pull-high resistor. Choice falling edge trigger or falling/rising edge trigger by mask option. Falling edge triggered active on a high to low transition. Rising edge triggered active on a low to high transition. OSC1 OSC2 ¾ RC or Crystal OSC1 and OSC2 are connected to an RC network or a crystal (by mask option) for the internal system clock. In the case of RC operation, OSC2 is the output terminal for 1/4 system clock. The system clock may come from the crystal, the two pins cannot be floating. AUD O ¾ Audio output for driving a external transistor or for driving HT82V733 Absolute Maximum Ratings Supply Voltage ..........................VSS -0.3V to VSS+5.5V Storage Temperature ........................... -50°Cto125°C Input Voltage .............................VSS -0.3V to VDD+0.3V Operating Temperature .......................... -20°Cto70°C Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil- ity. HT86030/HT86070 Rev. 1.00 5 February 20, 2006 |
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