001-01 / 20130701 / emc_esr_yff-p_en.fm

All specifications are subject to change without notice.

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RECOMMENDED SOLDERING CONDITION

REFLOW SOLDERING

HAND SOLDERING

PRECAUTIONS FOR USE

Before soldering, be sure to preheat components. The

T pre-

heating temperature must be 150°C max. with attention paid to

thermal shock.

Natural cooling of components in the air is recommended. On

the other hand, when dipping them in a solvent for purposes,

such as cleaning, make sure that the temperature difference

(

T) is 100°C.

When performing hand soldering for circuit modification, apply

the soldering iron to the copper foil area of the printed circuit

board for 3 seconds or less. The temperature of the iron tip

should not exceed 300°C.

Use a wrist band to discharge static electricity in your body

through the grounding wire.

When incorporating the printed circuit board on which this prod-

uct is mounted into a frame, etc., do not apply stress to the prod-

uct through local bending of the board by tightening of screws,

etc.

Overview of YFF-P Series

Preheating

Soldering

Slow cooling

(Natural cooling)

60 seconds or more

0

260˚C max.

10s max.

Preheating

300

Make as short as possilble (within three seconds)

0