6.4 Thermal Information: OPA1655

THERMAL METRIC(1)

OPA1655

UNIT

D (SOIC)

DBV (SOT23)

8 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

120.9

143.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

58.9

68.4

°C/W

RθJB

Junction-to-board thermal resistance

65.1

39.2

°C/W

ψJT

Junction-to-top characterization parameter

13.5

20.4

°C/W

ψJB

Junction-to-board characterization parameter

64.2

39.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA1656

THERMAL METRIC(1)

OPA1656

UNIT

D (SOIC)

8 PINS

RθJA

Junction-to-ambient thermal resistance

119.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

51.8

°C/W

RθJB

Junction-to-board thermal resistance

65.4

°C/W

ψJT

Junction-to-top characterization parameter

10.0

°C/W

ψJB

Junction-to-board characterization parameter

64.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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OPA1655, OPA1656

SBOS901C – MARCH 2019 – REVISED SEPTEMBER 2022

Copyright © 2022 Texas Instruments Incorporated

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Product Folder Links: OPA1655 OPA1656