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HCSM Datasheet(PDF) 2 Page - Stackpole Electronics, Inc.

Part # HCSM
Description  High Power Metal Element Current Shunt Resistor
PDF  5 Pages
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Manufacturer  SEI [Stackpole Electronics, Inc.]
Direct Link  https://www.seielect.com/
Logo SEI - Stackpole Electronics, Inc.

HCSM Datasheet(HTML) 2 Page - Stackpole Electronics, Inc.

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Rev Date: 4/18/2022
2
www.seielect.com
This specification may be changed at any time without prior notice.
marketing@seielect.com
Please confirm technical specifications before you order and/or use.
HCSM Series
High Power Metal Element Current Shunt Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Environmental Performance Characteristics
Function Performance Characteristics
Test
Test Method
Test Specification
Test Condition
Resistance to Solder
Heat
MIL-STD-202,
Method 210
ΔR: ± (1% + 0.0005 Ω)
Mount the chip to test substrate. Apply pressure in direction of arrow
unit band width reaches 2 mm (+0.2 / -0 mm) illustrated in the picture
below and hold for 10 ± 1 seconds. (JIS-C5202-6.1)
Bending Strength
ΔR: ± (1% + 0.0005 Ω)
JIS-C5202-6.1
Verify marking
permanency. (Not
required for laser
etched parts or parts
with no marking).
The chip is completely immersed in isopropyl alcohol
for 3 (+5/-0) minutes at 25°C ± 5°C.
Solvent Resistance
MIL-STD-202,
Method 215
The chip shall be immersed into the flux specified in the solder bath
260°C ± 5°C for 10 ± 1 seconds.
Test
Test Method
Test Specification
Test Condition
Short Time Overload
JIS-C5202-5.5
ΔR: ± (1% + 0.0005 Ω)
4 times rated power for 5 seconds
+25ºC / +125ºC
Operating temperature range is -55°C to +170°C
The chip (mounted on board) is exposed, -55°C ± 3ºC (30 minutes) /
+125 ± 2ºC (30 minutes) for 5 cycles.
The following conditions as the figure below.
Rapid Change
of Temperature
ΔR: ± (1% + 0.0005 Ω)
ΔR: ± (1% + 0.0005 Ω)
JIS-C5202-7.10
JIS-C5202-7.4
Load Life
Apply rated power at 70°C ± 2°C for 1000 hours with 1.5 hours ON
and 0.5 hour OFF.
JIS-5202-5.2
Temperature
Coefficient
of Resistance (TCR)
Refer to
Electrical Specifications
JIS-C5202-7.2
Damp Heat with Load
The chip (mounted on board) is exposed in the heat chamber,
125ºC ± 3°C for 1000 hours
High Temperature
Exposure
The specimens shall be placed in a chamber and subjected to a relative
humidity of 90 ~ 95% and a temperature of 40°C ± 2°C for a period of
1000 hours with applied rated power, 1.5 hours ON and 0.5 hour OFF.
ΔR: ± (1% + 0.0005 Ω)
ΔR: ± (1% + 0.0005 Ω)
MIL-STD-202
Method 103
ΔR
R x
Δt
10
=
TCR (ppm/ºC)
x
6



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