L9300 datasheet(181/182 Pages) STMICROELECTRONICS

181 / 182 page

Figure 53.

WD FSM evolution. WD_TO_RST_EN =0 ................................................ 88

Figure 54.

WD FSM evolution. WD_TO_RST_EN = 1 ................................................ 88

Figure 55.

State evolution in case of WD_TO_RST_EN=1............................................. 89

Figure 56.

Driver actuation and WD_RTS versus WD_CNT value........................................ 90

Figure 57.

Seed generation algorithm block diagram................................................. 91

Figure 58.

Seed selection and elaboration flow .................................................... 91

Figure 59.

Answer check generation algorithms block diagram.......................................... 92

Figure 60.

CAN wake up capabilities ........................................................... 94

Figure 61.

CAN transition time ................................................................ 95

Figure 62.

SPI Frame ...................................................................... 99

Figure 63.

SPI timing ..................................................................... 101

Figure 64.

voltage monitor self test basic implementation ............................................ 156

Figure 65.

Oscillator monitor ................................................................ 158

Figure 66.

diagnostic analog self test basic implementation ........................................... 158

Figure 67.

ADC self-test block diagram ......................................................... 160

Figure 68.

Analog trimming mask concept ....................................................... 161

Figure 69.

Diagnostic analog self test basic implementation........................................... 161

Figure 70.

PWM test implementation assuming LS configuration ....................................... 162

Figure 71.

Functional table diagram ........................................................... 164

Figure 72.

TQFP80 (14x14x1 mm. exp. pad up) package outline ....................................... 166

Figure 73.

TQFP80 (14x14x1 mm. exp. pad up) marking information .................................... 168

Figure 74.

TQFP80 (14x14x1 mm. exp. pad down) package outline ..................................... 169

Figure 75.

TQFP80 (14x14x1 mm. exp. pad down) marking information .................................. 171

L9300

List of figures

DS12258 - Rev 4

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