NC Series

www.vishay.com

Vishay Electro-Films

Revision: 08-Apr-2021

3

Document Number: 61033

For technical questions, contact: efi@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

DIMENSIONS

Options: gold bond pads 15 kÅ; lower profile version is available, consult applications engineer

0.5 pF to 1.3 pF

1.4 pF to 3.9 pF

4 pF to 9.1 pF

10 pF to 51 pF

NCAA

0.020 ± 0.003 inches square

33 pF to 100 pF

56 pF to 220 pF

150 pF to 510 pF

360 pF to 1000 pF

NCBB

0.030 ± 0.003 inches square

NCCC

0.040 ± 0.003 inches square

NCDD

0.055 ± 0.003 inches square

NCEE

0.060 ± 0.003 inches square

MECHANICAL SPECIFICATIONS

PARAMETER

VALUE

Chip Size

Per diagrams

Chip Thickness

0.010" ± 0.002" (0.25 mm ± 0.05 mm)

Chip Substrate Material

Semiconductor silicon

Dielectric

Silicon dioxide/silicon nitride

Bond Pad

0.005" x 0.005" min., 10 kÅ aluminum

Backing

3 kÅ min. gold

GLOBAL PART NUMBER INFORMATION

SAP Part Number: NCAA4700CKMAHWS

NCEE10000KNGKWS

SAP Description: NCAA 4.7 pF 10 % MOS Al H WS

NCEE 1000 pF 10 % MNOS Au K WS

MODEL

CAPACITANCE

(pF)

CAPACITANCE

MULTIPLIER

CODE

TOLERANCE

CODE

DIELECTRIC

TERMINATION

VISUAL

CLASS

PACKAGING

CODE

NCAA

NCBB

NCCC

NCDD

NCEE

First 4 digits

are significant

figures of

capacitance

D = 0.0001

C = 0.001

B = 0.01

A = 0.1

0 = 1

D = ± 0.5 pF

H = 2.5 %

J = 5.0 %

K = 10 %

M = 20 %

M = MOS

N = MNOS

G = Au

A = Al

H = class H

K = class K

WS =

waffle pack

100 min.,

1 mult.

700

C

M

A

H

K

A

WS

A

NC

4