6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VS

Supply voltage, VS = (V+) – (V–)

26

V

Input voltage

Common-mode

(V–) –0.5

(V+) + 0.5

V

Differential

(V+) – (V–) + 0.2

Output short-circuit(2)

Continuous

TJ

Operating junction temperature

-40

150

°C

Tstg

Storage temperature

-65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

4000

V

Charged-device model (CDM), per JANSI/ESDA/JEDEC JS-002(2)

1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VS

Supply

voltage

Single supply

4.5

24

V

Dual supply

±2.25

±12

TA

Specified temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

OPA2186

UNIT

DDF (SOT-23)

D (SOIC)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

150.4

128.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

85.6

69.2

°C/W

RθJB

Junction-to-board thermal resistance

70.0

72.3

°C/W

ΨJT

Junction-to-top characterization parameter

8.1

20.7

°C/W

ΨJB

Junction-to-board characterization parameter

69.6

71.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA2186

SBOS968A – JUNE 2022 – REVISED SEPTEMBER 2022

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