Traditional, Coplanar and

Direct Mate Orthogonal

ExaMAX® High-Speed Backplane System

• Meets a variety of industry specifications

• Exceeds OIF CEI-28G-LR specification for 28 Gbps standards

• 24 - 72 pair designs (4 and 6 pairs; 6, 8, 10 and 12 columns)

• Wafer design increases isolation for reduced crosstalk

• Press-fit tails provide a reliable electrical connection

ExaMAX® High-Speed Backplane Cable Assemblies

• 30 & 34 AWG Eye Speed® Ultra Low Skew Twinax Cable offers

improved signal integrity, increased flexibility and routability

• Highly customizable with modular flexibility

• Reduce costs due to lower layer counts

• Multiple end options available

KEY SPECIFICATIONS

FEATURES & BENEFITS

PITCH

INSULATOR MATERIAL

CONTACT MATERIAL

PLATING

OPERATING TEMP RANGE

CURRENT

RATING

2.00 mm

LCP

Zinc Alloy (EGBX Series only)

Copper Alloy

Sn over 50 µ"

(1.27 µm) Ni

-55 °C to +105 °C

4.2 A per pin

HIGH-SPEEDBACKPLANE

CONNECTOR&CABLESYSTEMS

Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.

samtec.com/ExaMAX

Staggered

Differential Pair Design

Two Reliable Points of

Contact at All Times

Intermateable with all

ExaMAX® Connectors

Wafer Design

Reduces Crosstalk

(2.00 mm) .0787" PITCH

F-221 (Rev 02MAR21)