REF192 datasheet(5/21 Pages) AD

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Data Sheet

ADR3625

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 5 of 21

Table 3.

Parameter

Rating

VIN to GND SENSE

–0.3 V to +18 V

ENABLE to GND SENSE

–0.3 V to +18 V

VOUT FORCE to GND SENSE

–0.3 V to VIN + 0.3 V

VOUT SENSE to VOUT FORCE

–0.3 V to +0.3 V

GND FORCE to GND SENSE

–0.3 V to +0.3 V

Temperature

Storage Range

–65°C to +150°C

Operating Range

–40°C to +125°C

Junction Range

–65°C to +150°C

Lead, Soldering (10 sec)

300°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to PCB

thermal design is required.

θJA is the natural convection junction-to-ambient thermal resistance

measured in a one cubic foot sealed enclosure, and θJC is the

junction-to-case thermal resistance.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

RM-8

132.5

43.9

°C/W

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADR3625

Table 5. ADR3625, 8-Lead MSOP

ESD Model

Withstand Threshold (kV)

Class

HBM

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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