Rev Date: 09/30/2020

2

www.seielect.com

This specification may be changed at any time without prior notice.

marketing@seielect.com

Please confirm technical specifications before you order and/or use.

RAF Series

Flat Termination Chip Resistor Array

Stackpole Electronics, Inc.

Resistive Product Solutions

Soldering Condition

Performance Characteristics (cont.)

Power Derating Curve:

(1) Time of IR reflow soldering at maximum temperature point 260ºC: 10 seconds

(2) Time of wave soldering at maximum temperature point 260ºC: 10 seconds

(3) Time of soldering iron at maximum temperature point 410ºC: 5 seconds

± 1%

± 5%

Jumper

JIS-C-5201-1 4.33

IEC-60115-1 4.33

JIS-C-5201-1 4.17

IEC-60115-1 4.17

JIS-C-5201-1 4.18

IEC-60115-1 4.18

JIS-C-5201-1 4.7

IEC-60115-1 4.7

JIS-C-5201-1 4.18

IEC-60068-2-58 8.2.1

JIS-C-5201-1 4.19

IEC-60115-1 4.19

Operating Temperature Range: -55ºC +125ºC, 25ºC is the reference temperature

RCWV (Rated Continuous Working Voltage) =

or Max. Operating Voltage whichever is lower.

Storage Temperature: 25 ± 3ºC; Humidity < 80% RH

Individual leaching area

≤ 5%

Total leaching are

≤ 10%

Leaching

± (0.5% + 0.05 Ω)

± (1.0% + 0.05 Ω)

< 50m Ω

Rapid Change of

Temperature

260 ± 5ºC for 30 seconds

-55ºC to +125 / +155ºC, 5 cycles

± (1.0% + 0.05 Ω)

± (1.0% + 0.05 Ω)

Bending once for 5 seconds

with 3 mm

No breakdown or flashover

Voltage Proof

260 ± 5ºC for 10 seconds

1.42 times Max. Operating Voltage

for 1 minute

Solderability

95 % min. coverage

245 ± 5ºC for 3 seconds

Resistance to

Soldering Heat

± (0.5% + 0.05 Ω)

± (1.0% + 0.05 Ω)

< 50m Ω

Bending Strength

< 50m Ω

Test

Test Method

Test Condition

Test Specification

√ P*R