Datasheet

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TSZ02201-0RAR1G200010-1-2

© 2012 ROHM Co., Ltd. All rights reserved.

24/26

4.SEP.2012 Rev.003

TSZ22111･15･00

BA4558xxx, BA4558Rxxx

●Operational Notes

1) Processing of unused circuit

It is recommended to apply connection (see the Fig.55) and set the non inverting

input terminal at the potential within input common-mode voltage range (Vicm),

for any unused circuit.

2) Input voltage

Applying (VEE - 0.3) to (VEE + 36)V

(BA4558R)

to the input terminal is possible without causing deterioration of the

electrical characteristics or destruction, irrespective of the supply voltage.

However, this does not ensure normal circuit operation. Please note that the

circuit operates normally only when the input voltage is within the common mode

input voltage range of the electric characteristics.

3) Maximum output voltage

Because the output voltage range becomes narrow as the output current

Increases, design the application with margin by considering changes in

electrical characteristics and temperature characteristics.

4) Short-circuit of output terminal

When output terminal and VCC or VEE terminal are shorted, excessive Output

current may flow under some conditions, and heating may destroy IC. It is

necessary to connect a resistor as shown in Fig.56, thereby protecting against

load shorting.

5) Power supply (split supply / single supply) in used

Op-amp operates when specified voltage is applied between VCC and VEE.

Therefore, the single supply Op-Amp can be used for double supply Op-Amp as well.

6) Power dissipation (Pd)

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating

conditions.

7) Short-circuit between pins and wrong mounting

Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other

components on the circuits, can damage the IC.

8) Use in strong electromagnetic field

Using the ICs in strong electromagnetic field can cause operation malfunction.

9) Radiation

This IC is not designed to be radiation-resistant.

10) IC Handling

When stress is applied to IC because of deflection or bend of board, the characteristics may fluctuate due to piezoelectric

(piezo) effect.

11) Inspection on set board

During testing, turn on or off the power before mounting or dismounting the board from the test Jig. Do not power up the

board without waiting for the output capacitors to discharge. The capacitors in the low output impedance terminal can

stress the device. Pay attention to the electro static voltages during IC handling, transportation, and storage.

12) Output capacitor

When VCC terminal is shorted to VEE (GND) potential and an electric charge has accumulated on the external capacitor,

connected to output terminal, accumulated charge may be discharged VCC terminal via the parasitic element within the

circuit or terminal protection element. The element in the circuit may be damaged (thermal destruction). When using this IC

for an application circuit where there is oscillation, output capacitor load does not occur, as when using this IC as a

voltage comparator. Set the capacitor connected to output terminal below 0.1

μF in order to prevent damage to IC.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority.

application circuit for unused op-amp

Fig. 55

The example of

Fig. 56

The example of

output short protection

Connect

to Vicm

VCC

VEE

Vicm

-

+

VEE

VCC

+

-

protection

resistor