[Data Sheet]

[SMLP14x series]

４－６．Reflow Profile

For reflow profile, please refer to the conditions below:(※)

■Meaning of marks, Conditions

Mark

Tsmax

Tsmin

ts

TL

Conditions

180℃

140℃

Over 60sec.

230〜260℃

Meanings

Maximum of pre-heating temperature

Solvent

We recommend to use alcohols solvent such as, isopropyl alcohols

RECOMMENDED CONDITION

Condition ) Temp. of iron top less than

400℃ within 3 sec.

Heating on PCB pattern, not direct to the

LED. (Fig-1)

４－８．Cleaning after Soldering

Please follow the conditions below if the cleaning is necessary after soldering.

Sn-Cu，Sn-Ag-Cu，Sn-Ag-Bi-Cu

②HAND SOLDERING CONDITION

LED products do not contain reinforcement material such as a glass fillers.

※Above conditions are for reference. Therefore, evaluate by customerʼs own circuit boards and

reflow furnaces before using, because stress from circuit boards and temperature variations of reflow

４－７．Attention Points in Soldering Operation

This product was developed as a surface mount LED especially suitable for reflow soldering.

So reflow soldering is recommended. In case of implementing manual soldering,

please take care of following points.

①SOLDER USED

Peak temperature

Within 10sec.

Under 3℃/sec.

Over -3℃/sec.

tL

TP

tP

ΔTR/Δt

Minimum of pre-heating temperature

Time from Tsmin to Tsmax

Reference temperature

ΔTD/Δt

Temperature decreasing rate

Retention time for TL

Time for peak temperature

Temperature rising rate

Within 40sec.

260℃(Max)

Ultrasonic Cleaning

15W／Below 1 liter (capacity of tank)

Drying

Under 100℃ within 3 minutes

furnaces vary by customerʼs own conditions.

So thermal stress by soldering greatly influence its reliability.

Please keep following points for manual soldering.

ITEM

a)

Heating method

b)

Handling after

soldering

Please handle after the part temp.

goes down to room temp.

Temperature

Under 30℃ within 3 minutes

Fig‐1

SOLDERING

LAND

SOLDERING IRON

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