PI3DPX1203

A product Line of

Diodes Incorporated

27 of 43

www.diodes.com

February 2021

© Diodes Incorporated

PI3DPX1203

Document number DS40598 Rev 2-2

7.3 Layout Guidelines

As transmission data rate increases rapidly, any flaws and/or mis-matches on PCB layout are amplified in terms of signal integrity. Lay-

out guideline for high-speed transmission is highlighted in this application note.

7.3.1 AC coupling Capacitor

Below is an example of placing AC coupling capacitors on high-speed channels.

7.3.2 Location

To wisely use the equalization selections offered by PI3DPX1203, it is recommended to place PI3DPX1203 at the end of the entire path.

In short, PI3DPX1203 should be located close to the output DP connector in a source application. Below is the PI3DPX1203 placement

on its evaluation board.

7.3.3 Thermal Pad GND Via Recommendation

To wisely use the equalization selections offered by PI3DPX1203, it is recommended to place PI3DPX1203 at the end of the entire path.

In short, PI3DPX1203 should be located close to the output DP connector in a source application. Below is the PI3DPX1203 placement

on its evaluation board .

Several GND vias are the “must” requirement in thermal pad. The recommended Via size is 12/24 mil.