Datasheet

Datasheet

8/36

TSZ02201-0G1G0AN00066-1-2

© 2015 ROHM Co., Ltd. All rights reserved.

22.Feb.2017 Rev.006

www.rohm.com

TSZ22111･15･001

BD4xxM5-C Series

●

Thermal

Impedance (1)

Parameter

Symbol

Typ.

Unit

Conditions

TO252-J5(F) / TO252-3

Junction to Ambient

θJA

136

°C / W

1s

(2)

23

°C / W

2s2p

(3)

Junction to Top Center of Case (4)

ΨJT

17

°C / W

1s

(2)

3

°C / W

2s2p

(3)

TO263-5(F) / TO263-3(F)

Junction to Ambient

θJA

81

°C / W

1s

(2)

21

°C / W

2s2p

(3)

Junction to Top Center of Case (4)

ΨJT

8

°C / W

1s

(2)

2

°C / W

2s2p

(3)

(1)

The thermal impedance is based on JESD51 - 2A (Still-Air) standard.

(2)

JESD51 - 3 standard FR4 114.3 mm × 76.2 mm × 1.57 mm 1-layer (1s)

(Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.)

(3)

JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mm 4-layer（2s2p）

(Top copper foil: ROHM recommended footprint + wiring to measure / 2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm,

copper (top & reverse side / inner layers) 2oz. / 1oz.)

(4)

TT : Top center of case’s (mold) temperature