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STP3N150 Datasheet(PDF) 4 Page - STMicroelectronics |
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STP3N150 Datasheet(HTML) 4 Page - STMicroelectronics |
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4 / 22 page ![]() Table 7. Source-drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit ISD Source-drain current - 2.5 A ISDM (1) Source-drain current (pulsed) - 10 A VSD (2) Forward on voltage VGS = 0 V, ISD = 2.5 A - 1.6 V trr Reverse recovery time ISD = 2.5 A, di/dt = 100 A/µs, VDD = 60 V (see Figure 19. Test circuit for inductive load switching and diode recovery times) - 410 ns Qrr Reverse recovery charge - 2.4 µC IRRM Reverse recovery current - 11.7 A trr Reverse recovery time ISD = 2.5 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C (see Figure 19. Test circuit for inductive load switching and diode recovery times) - 540 ns Qrr Reverse recovery charge - 3.3 µC IRRM Reverse recovery current - 12.3 A 1. Pulse width is limited by safe operating area. 2. Pulse test: pulse duration = 300 µs, duty cycle 1.5%. STFW3N150, STH3N150-2, STP3N150, STW3N150 Electrical characteristics DS5052 - Rev 12 page 4/22 |
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