AP9563GK datasheet(2/4 Pages) A-POWER

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Electrical Characteristics@Tj=25

oC(unless otherwise specified)

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

BVDSS

Drain-Source Breakdown Voltage

VGS=0V, ID=-250uA

-40

ΔBV

DSS/ΔTj

Breakdown Voltage Temperature Coefficient

Reference to 25℃, ID=-1mA

-0.03

V/℃

RDS(ON)

Static Drain-Source On-Resistance

VGS=-10V, ID=-6A

mΩ

VGS=-4.5V, ID=-4A

mΩ

VGS(th)

Gate Threshold Voltage

VDS=VGS, ID=-250uA

-1

-3

gfs

Forward Transconductance

VDS=-10V, ID=-6A

IDSS

Drain-Source Leakage Current (Tj=25

oC)

VDS=-40V, VGS=0V

-1

Drain-Source Leakage Current (Tj=70

oC)

VDS=-32V, VGS=0V

-25

IGSS

Gate-Source Leakage

VGS=±25V

±100

Total Gate Charge

ID=-6A

Qgs

Gate-Source Charge

VDS=-32V

Qgd

Gate-Drain ("Miller") Charge

VGS=-4.5V

td(on)

Turn-on Delay Time

VDS=-20V

Rise Time

ID=-1A

td(off)

Turn-off Delay Time

RG=3.3Ω,VGS=-10V

Fall Time

RD=20Ω

-36

Ciss

Input Capacitance

VGS=0V

1600

2560

Coss

Output Capacitance

VDS=-25V

240

Crss

Reverse Transfer Capacitance

f=1.0MHz

185

Gate Resistance

f=1.0MHz

5.8

8.7

Source-Drain Diode

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VSD

Forward On Voltage

IS=-2.2A, VGS=0V

-1.3

Reverse Recovery Time

IS=-6A, VGS=0V,

Qrr

Reverse Recovery Charge

dI/dt=100A/µs

Notes:

1.Pulse width limited by Max. junction temperature.

2.Pulse width <300us , duty cycle <2%.

2/4

AP9563GK

3.Surface mounted on 1 in

2 copper pad of FR4 board, t <10sec ; 120 ℃/W when mounted on Min. copper pad.

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