RC1206 datasheet(9/10 Pages) YAGEO

9 / 10 page

Chip Resistor Surface Mount

www.yageo.com

May. 11, 2022 V.4

Product specification

SERIES

RC_P

0100 to 2512

TEST

TEST METHOD

PROCEDURE

REQUIREMENTS

Board Flex/

Bending

IEC 60115-1 4.33

Device mounted or as described only 1 board

bending required

bending time: 60± 5 seconds

0100/0201/0402:5mm;

0603/0805:3mm;

1206 and above:2mm

± (1%+0.05Ω) for D/F/J Tol

<50mR for jumper

No visible damage

Solderability

- Wetting

IPC/JEDECJ-STD-002B test B

IEC 60068-2-58

Electrical Test not required Magnification 50X

SMD conditions:

1st step: method B, aging 4 hours at 155 °C

dry heat

2nd step: leadfree solder bath at 245± 3 °C

Dipping time: 3± 0.5 seconds

Well tinned

(>95% covered)

No visible damage

-Leaching

IPC/JEDECJ-STD-002B test D

IEC 60068-2-58

Leadfree solder ,260°C, 30 seconds immersion

time

No visible damage

-Resistance to

Soldering Heat

MIL-STD-202F Method 210F

IEC 60068-2-58

Condition B, no pre-heat of samples

Leadfree solder, 260 °C ± 5℃, 10 ± 1 seconds

immersion time

Procedure 2 for SMD: devices fluxed and

cleaned with isopropanol

0100: ± (1%+0.05Ω)

Others:

± (0.5%+0.05Ω) for D/F tol

± (1%+0.05Ω) for J tol

<50mR for jumper

No visible damage

RC1206 Datasheet(PDF) 9 Page - YAGEO Corporation

RC1206 Datasheet(HTML) 9 Page - YAGEO Corporation

Html Pages

1 2 3 4 5 6 7 8 9 10

Datasheet Download

Link URL