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DF2S8.2CT Datasheet(PDF) 2 Page - Toshiba Semiconductor |
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DF2S8.2CT Datasheet(HTML) 2 Page - Toshiba Semiconductor |
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2 / 6 page ![]() DF2S8.2CT 2 4. Electrical Characteristics (Unless otherwise specified, Ta = 25�) VRWM: Working peak reverse voltage VBR: Reverse breakdown voltage IBR: Reverse breakdown current IR: Reverse current VC: Clamp voltage IPP: Peak pulse current RDYN: Dynamic resistance Fig. 4.1 Definitions of Electrical Characteristics Characteristics Zener voltage Dynamic impedance Reverse current Total capacitance Symbol VZ ZZ IR Ct Note Test Condition IZ = 5 mA IZ = 5 mA VR = 6.5 V VR = 0 V, f = 1 MHz Min 7.7 � � � Typ. 8.2 � � 20 Max 8.7 30 0.5 � Unit V Ω µA pF 5. Guaranteed ESD Protection (Note) Test Condition IEC61000-4-2 (Contact discharge) ESD Protection ±30 kV Note: Criterion: No damage to devices. 2022-02-09 Rev.5.0 ©2022 Toshiba Electronic Devices & Storage Corporation |
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