©2020 Littelfuse, Inc.

Specifications are subject to change without notice.

TVS Diode Arrays (SPA®Diodes)

Revision: 03/17/21

Low Capacitance ESD Protection - SP4337

Part Numbering System

Part Marking System

SP 4337 01

T G

Series

Number of

Channels

Package

W: Flipchip

T= Tape & Reel

G= Green

–

TVS Diode Arrays

(SPA® Diodes)

W

D

Ordering Information

Part Number

Package

Min. Order Qty.

SP4337-01WTG

Flipchip

10000

Product Characteristics

Time

TP

TL

TS(max)

TS(min)

25

tP

tL

tS

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Critical Zone

TL to TP

Critical Zone

TL to TP

Reflow Condition

Pb – Free assembly

Pre Heat

- Temperature Min (T

s(min))

150°C

- Temperature Max (T

s(max))

200°C

- Time (min to max) (t

s)

60 – 180 secs

Average ramp up rate (Liquidus) Temp (T

L)

to peak

3°C/second max

T

S(max) to TL - Ramp-up Rate

3°C/second max

Reflow

- Temperature (T

L) (Liquidus)

217°C

- Temperature (t

L)

60 – 150 seconds

Peak Temperature (T

P)

260+0/-5 °C

Time within 5°C of actual peak

Temperature (t

p)

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

P)

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

Lead Plating

Tin plating

Lead Material

Copper bump

Substrate Material

Silicon

Flammability

UL Recognized compound meeting

flammability rating V-0