2

Technical Data ELX1178

Effective June 2022

MFHA

SMD current sensing resistor-metal film

www.eaton.com/electronics

Mechanical parameters- Inches [mm]

Recommended pad layout-mm

Family

Size code

L

W

C

d

t

MFHA1206

1206

[3216]

0.126 ± 0.008

[3.20 ± 0.20]

0.063 ± 0.008

[1.60 ± 0.20]

0.020 ± 0.012

[0.50 ± 0.30]

0.016 ± 0.008

[0.40 ± 0.20]

0.022 ± 0.004

[0.55 ± 0.10]

MFHA2512

2512

[6432]

0.252 ± 0.008

[6.40 ± 0.20]

0.126 ± 0.008

[3.20 ± 0.20]

0.024 ± 0.012

[0.60 ± 0.30]

0.020 ± 0.010

[0.50 ± 0.25]

0.022 ± 0.004

[0.55 ± 0.10]

Construction

Over Coat

Resistive Element

Ceramic Substrate

Sn Plating

Ni Plating

Conductor

Part marking: Rxxx: (xxx= resistance value in ohms expressed in 3 digits, 100 = 0.100 Ω or 100 mΩ)

Family

a

b

c

MFHA1206

0.7

5.1

2.5

MFHA2512

1.0

7.5

4.2

1. The copper foil minimum thickness of PCB needs 3 oz.

2. Pad layout dimension tolerance is ±-0.1 mm.

3. The resistance will change slightly after soldered; it is dependent

on PCB pad size deign and it’s necessary to consider the effect of the

resistance increase or decrease.