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TLV704 Datasheet(PDF) 20 Page - Texas Instruments |
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TLV704 Datasheet(HTML) 20 Page - Texas Instruments |
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20 / 29 page ![]() 9 Device and Documentation Support 9.1 Device Support 9.1.1 Development Support 9.1.1.1 Evaluation Module An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TLV704. The TLV70433DBVEVM-712 evaluation module (and related user guide) can be requested at the Texas Instruments website through the product folders or purchased directly from the TI eStore. 9.1.2 Device Nomenclature Table 9-1. Available Options(1) PRODUCT VOUT TLV704xxyyyz Legacy chip xx is the nominal output voltage (for example 33 = 3.3 V). yyy is the package designator. z is the package quantity. TLV704xxyyyzM3 New chip xx is the nominal output voltage (for example 33 = 3.3 V). yyy is the package designator. z is the package quantity. M3 is a suffix designator for newer chip redesigns, fabricated on the latest TI process technology. (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. 9.2 Documentation Support 9.2.1 Related Documentation For related documentation see the following: • Texas Instruments, TLV70433DBVEVM-712, TLV70433PKEVM-712 Evaluation Modules user guide 9.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 9.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 9.5 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 9.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 9.7 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. TLV704 SBVS148E – SEPTEMBER 2010 – REVISED DECEMBER 2022 www.ti.com 20 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TLV704 |
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