Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................3

6 Pin Configuration and Functions...................................4

7 Specifications.................................................................. 5

7.1 Absolute Maximum Ratings........................................ 5

7.2 ESD Ratings............................................................... 5

7.3 Recommended Operating Conditions.........................5

7.4 Thermal Information....................................................5

7.5 Electrical Characteristics THS3091............................ 6

7.6 Electrical Characteristics THS3095............................ 8

7.7 Dissipation Ratings Table..........................................12

7.8 Typical Characteristics (±15 V)................................. 13

7.9 Typical Characteristics (±5 V)................................... 20

8 Detailed Description......................................................24

8.1 Overview................................................................... 24

8.2 Feature Description...................................................24

8.3 Device Functional Modes..........................................25

9 Application and Implementation.................................. 28

9.1 Application Information............................................. 28

9.2 Typical Application.................................................... 31

10 Power Supply Recommendations..............................34

11 Layout........................................................................... 34

11.1 Layout Guidelines................................................... 34

11.2 Layout Example...................................................... 35

11.3 PowerPAD Design Considerations..........................37

11.4 PowerPAD Layout Considerations.......................... 38

11.5 Power Dissipation and Thermal Considerations..... 39

12 Device and Documentation Support..........................40

12.1 Device Support....................................................... 40

12.2 Documentation Support.......................................... 40

12.3 Receiving Notification of Documentation Updates..40

12.4 Support Resources................................................. 40

12.5 Trademarks.............................................................40

12.6 Electrostatic Discharge Caution..............................40

12.7 Glossary..................................................................41

13 Mechanical, Packaging, and Orderable

Information.................................................................... 41

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (October 2015) to Revision I (December 2022)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Added the DGN package information to the data sheet..................................................................................... 1

• Added the Device Comparison Table section..................................................................................................... 3

• Updated Thermal Information table.................................................................................................................... 5

Changes from Revision G (February, 2007) to Revision H (October 2015)

Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and

Documentation Support section, and Mechanical, Packaging, and Orderable Information section................... 1

Changes from Revision F (February, 2007) to Revision G (February, 2007)

Page

• Changed common-mode rejection ratio specifications from 78 dB (typ) to 69 dB (typ); from 68 dB at +25°C to

62 dB; from 65 dB at (0°C to +70°C) and (–40°C to +85°C) to 59 dB................................................................ 6

• Corrected load resistor value for output current specification (sourcing and sinking) from RL = 40 Ω to RL = 10

Ω......................................................................................................................................................................... 8

• Changed output current (sourcing) specifications from 200 mA (typ) to 180 mA (typ); from 160 mA at +25°C

to 140 mA; from 140 mA at (0°C to +70°C) and (–40°C to +85°C) to 120 mA................................................... 8

• Corrected output current (sinking) specifications from 180 mA (typ) to –160 mA (typ); from 150 mA at +25°C

to –140 mA; from 125 mA at (0°C to +70°C) and (–40°C to +85°C) to –120 mA............................................... 8

THS3091, THS3095

SLOS423I – SEPTEMBER 2003 – REVISED DECEMBER 2022

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