AS1105WE4 datasheet(2/12 Pages) AMSCO

2 / 12 page

Data Sheet AS1105

Revision 1.32, Oct. 2004

Page 2 of 12

Absolute Maximum Ratings

Voltage (with respect to GND)

VDD

-0.3V to 6V

DIN, CLK, LOAD

-0.3V to 6V

All Other Pins

-0.3V to (VDD +0.3V)

Current

DIG0–DIG3 Sink Current

500mA

SEGA–G, DP Source Current

100mA

Continuous Power Dissipation (TA = +85°C)

Wide SO (derate 11.8mW/°C above +70°C)

941mW

Operating Temperature Ranges (TMIN to TMAX)

AS1105xL

0°C to +70°C

AS1105xE

-40°C to +85°C

Storage Temperature Range

-65°C to +150°C

Package body temperature 2

+240°C

Electrical Characteristics

(VDD = 5V, RSET = 9.53k

Ω±1%, TA = TMIN to TMAX, unless otherwise noted.)

Parameter

Symbol Conditions

Min

Typ

Max

Units

Operating Supply Voltage

VDD

4.0

5.0

5.5

Shutdown Supply Current

IDDSD

All digital inputs at VDD or GND, TA =

+25°C

µA

RSET = open circuit

500

µA

Operating Supply Current

IDD

All segments and decimal point on, ISEG = -

40mA

330

Display Scan Rate

fOSC

500

800

1300

Digit Drive Sink Current

IDIGIT

VOUT = 0.65V

320

Segment Drive Source Current

ISEG

TA = +25°C, VOUT = (VDD -1V)

-30

-40

-45

Segment Drive Current

Matching

∆ISEG

3.0

Digit Drive Source Current

IDIGIT

Digit off, VDIGIT = (VDD -0.3V)

-2

Segment Drive Sink Current

ISEG

Segment off, VSEG = 0.3V

Logic Inputs

Input Current DIN, CLK, LOAD

IIH, IIL VIN = 0V or VDD

-1

µA

Logic High Input Voltage

VIH

3.5

2 The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020B “Moisture/Reflow Sensitivity

Classification for non-hermetic Solid State Surface Mount Devices”.

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