AORN

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Vishay Dale Thin Film

Revision: 06-Apr-2021

2

Document Number: 60127

For technical questions, contact: thinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Note

• Gold thickness less than 10 μ"

STANDARD ELECTRICAL SPECIFICATIONS

TEST

SPECIFICATIONS

CONDITIONS

Material

Tantalum nitride (Ta2N)

-

Pin/Lead Number

8-

Resistance Range

1 k

Ω to 100 kΩ per resistor

-

TCR: Absolute

± 25 ppm/°C (standard)

-55 °C to +155 °C

TCR: Tracking

± 5 ppm/°C (typical)

-55 °C to +155 °C

Tolerance: Absolute

± 0.10 % to ± 1 %

At +25 °C temperature

Tolerance: Ratio

± 0.05 % to ± 0.1 %

At +25 °C temperature

Power Rating: Resistor

100 mW

Maximum at +70 °C

Power Rating: Package

400 mW

Maximum at +70 °C

Stability: Absolute

ΔR ± 0.05 %

1000 h at +155 °C

Stability: Ratio

ΔR ± 0.015 %

1000 h at +155 °C

Voltage Coefficient

< 0.1 ppm/V

-

Working Voltage

100 V max. not to exceed

-

Operating Temperature Range

-55 °C to +155 °C

-

Storage Temperature Range

-55 °C to +155 °C

-

Noise

≤ -30 dB

-

Thermal EMF

0.08 μV/°C

-

Shelf Life Stability: Absolute

ΔR ± 0.01 %

1 year at +25 °C

Shelf Life Stability: Ratio

ΔR ± 0.002 %

1 year at +25 °C

P x R

DIMENSIONS AND IMPRINTING in inches and millimeters

DIMENSION

INCHES

MILLIMETERS

A

0.157

3.99

B

0.0165 ± 0.0025

0.4 ± 0.06

C

0.050

1.27

D

0.195 max.

4.93 max.

E

0.008 ± 0.001

0.20 ± 0.03

F

0.028 ± 0.001

0.71 ± 0.02

G

0.239 ± 0.001

6.07 ± 0.13

H

0.068 max.

1.73 max.

I

0.008 ± 0.002

6.07 ± 0.13

Seating

Plane

A

B

C

E

H

G

F

AORN

Date

Code

I

D

MECHANICAL SPECIFICATIONS

Resistive Element

Tantalum nitride (Ta2N)

Substrate Material

Ceramic

Body

Molded epoxy

Terminals

Copper alloy

Lead Frame Finish

Ni/Pd/Au solder free (1)

DERATING CURVE

Ambient Temperature °C

070

125

155

0

20

40

60

80

100

100 % = 0.40 W