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CP341V Datasheet(PDF) 1 Page - Central Semiconductor Corp

Part # CP341V
Description  Small Signal Transistors NPN - Low VCE(SAT) Transistor Chip
PDF  1 Pages
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Manufacturer  CENTRAL [Central Semiconductor Corp]
Direct Link  http://www.centralsemi.com
Logo CENTRAL - Central Semiconductor Corp

CP341V Datasheet(HTML) 1 Page - Central Semiconductor Corp

  CP341V Datasheet HTML 1Page - Central Semiconductor Corp  
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PROCESS
CP341V
Small Signal Transistors
NPN - Low VCE(SAT) Transistor Chip
PRINCIPAL DEVICE TYPES
CMLT3410
CMPT3410
CMST3410
CMUT3410
Process
Epitaxial Planar
Die Size
18 x 18 MILS
Die Thickness
7.1 MILS
Base Bonding Pad Area
3.8 x 3.8 MILS
Emitter Bonding Pad Area
3.8 x 3.8 MILS
Top Side Metalization
Al/Si - 30,000Å
Back Side Metalization
Au - 12,000Å
PROCESS DETAILS
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel:
(631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
GEOMETRY
R0 (5- January 2006)
GROSS DIE PER 5 INCH WAFER
54,330


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