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CPD07 Datasheet(PDF) 1 Page - Central Semiconductor Corp |
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CPD07 Datasheet(HTML) 1 Page - Central Semiconductor Corp |
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1 / 2 page ![]() 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com PRINCIPAL DEVICE TYPES CR6A2GPP Series GEOMETRY PROCESS DETAILS BACKSIDE CATHODE R2 (16-September 2003) Process GLASS PASSIVATED MESA Die Size 98 x 98 MILS Die Thickness 10.4 MILS Anode Bonding Pad Area 82.5 x 82.5 MILS Top Side Metalization Au - 5,000Å Back Side Metalization Au - 2,000Å GROSS DIE PER 4 INCH WAFER 1,170 Central Semiconductor Corp. TM PROCESS CPD07 General Purpose Rectifier 8 Amp Glass Passivated Rectifier Chip |
Similar Part No. - CPD07 |
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Similar Description - CPD07 |
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