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MIC2133 Datasheet(PDF) 37 Page - Microchip Technology |
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MIC2133 Datasheet(HTML) 37 Page - Microchip Technology |
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37 / 50 page ![]() 2022 Microchip Technology Inc. and its subsidiaries DS20006653B-page 37 MIC2133 low-side power MOSFET in each phase channel is mainly contributed by the conduction loss, and there is no switching loss for the low-side MOSFET in buck converter because the body diode of the low-side MOSFET is forward biased before the turn-on and after the turn-off of the low-side MOSFET, and this makes the voltage across the low-side MOSFET just equal to the body diode forward voltage during the turn-on and turn-off transition. Apart from the conduction loss, the low-side MOSFET body diode forward conduction loss, body diode reverse recovery loss and low-side MOSFET output capacitance discharge loss also contributed to the power dissipation in the low-side power MOSFET in each phase channel. The low-side MOSFET body diode forward conduction loss during dead time is calculated by the equation below. EQUATION 5-32: The low-side MOSFET body diode reverse recovery loss is calculated by the equation below. EQUATION 5-33: The low-side MOSFET output capacitance discharge loss can be calculated in the equation below. EQUATION 5-34: The total power dissipation of the low-side power MOS- FET in each phase channel is estimated in the equation below. EQUATION 5-35: Low-side MOSFETs can be accidentally turned on by the high dV/dt signal at the switching node; therefore, it is recommended that low-side MOSFETs with a high CGS/CGD ratio and low internal gate resistance be cho- sen to minimize the effect of dV/dt inducted turn-on. 5.5 Bootstrap Capacitor The MIC2133 device’s high-side gate drive circuits are designed to switch the N-Channel external MOSFETs. The MIC2133 “Functional Block Diagram” shows two internal bootstrap diodes and each one is between the PVDD and BST pins of each phase channel. These cir- cuits supply energy to the high-side gate drive circuits, with one for each phase. It is recommended that a low-ESR ceramic capacitor be connected between the BST pin and the SW pin of each phase channel (refer to the “Typical Application Circuit”). The bootstrap capacitors between the BST and SW pins, CBST1 and CBST2, are charged while the respective low-side MOSFET is turned on. When the respective high-side MOSFET driver is turned on, energy from CBSTx is used to turn the MOSFET on. A minimum of 0.1 μF low-ESR ceramic capacitor is recommended between the BSTx and SWx pins. The required value of CBSTx can be calculated using the equation below. EQUATION 5-36: 5.6 Setting Output Voltage The MIC2133 requires two resistors to set the output voltage, as shown in the figure below. FIGURE 5-3: Voltage-Divider Configuration. PBDDT LS 2IOUT MAX n ------------------------------------ V FBD tDT fSW = Where: VF(BD) = Forward Voltage of Low-Side MOSFET Body Diode tDT = Dead Time, which is about 20 ns PBDQRR LS VIN MAX QRR BDLS fSW = Where: QRR(BDLS) = Reverse Recovery Charge of Low-Side MOSFET Body Diode PCOSS LS 0.5 COSS LS VIN MAX 2 fSW = Where: COSS(LS) = Low-Side MOSFET Output Capacitance PDLS PCOND LS PBDDT LS PBDQRR LS PCOSS LS ++ + = CBSTx QGHS V CBSTx ---------------------- = Where: QG(HS) = Gate Charge of High-Side MOSFET in Each Phase ∆VCBSTx = Delta Voltage Drop Across CBST in Each Phase, Generally 50 mV to 100 mV |
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