LIS2L02AS4

12/14

7

Package Information

packages have a Lead-free second level interconnect. The category of second Level Interconnect is

marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The

maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 17. SO24 Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

2.35

2.65

0.093

0.104

A1

0.10

0.30

0.004

0.012

B

0.33

0.51

0.013

0.200

C

0.23

0.32

0.009

0.013

15.20

15.60

0.598

0.614

E

7.40

7.60

0.291

0.299

e

1.27

0.050

H

10.0

10.65

0.394

0.419

h

0.25

0.75

0.010

0.030

L

0.40

1.27

0.016

0.050

k

0˚ (min.), 8˚ (max.)

ddd

0.10

0.004

(1) “D” dimension does not include mold flash, protusions or gate

burrs. Mold flash, protusions or gate burrs shall not exceed

0.15mm per side.

SO24

0070769 C

Weight: 0.60gr