TDA7499SA datasheet(7/11 Pages) STMICROELECTRONICS

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TDA7499SA

HEAT SINK DIMENSIONING:

In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important

the dimensioning of the Heat Sinker RTh (°C/W).

The parameters that influence the dimensioning are:

– Maximum dissipated power for the device (Pdmax)

– Max thermal resistance Junction to case (RTh j-c)

– Max. ambient temperature Tamb max

– Quiescent current Iq (mA)

Example:

VCC = ±10V, Rload = 8ohm, RTh j-c = 3.9 °C/W , Tamb max = 50°C

Pdmax = (N° channels) ·

Pdmax = 2 · ( 2.5 ) + 0.8 = 6W

(Heat Sinker)

In figure 7 is shown the Power derating curve for the device.

Figure 10. Power Derating Curve

lo ad

⋅

--------------------------

⋅

Th c-a

150

am b max

–

d max

-----------------------------------------

Th j-c

–

150

–

----------------------

3.9

–

12.7

°C/W

Infinite Heatsink

10 °C/ W

15 °C/ W

(c)

(a)

(b)

120

160

Tamb (°C)

Infinite Heatsink

10 °C/ W

15 °C/ W

(c)

(a)

(b)

120

160

Tamb (°C)

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