H7809AI datasheet(12/12 Pages) HSMC

12 / 12 page

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : IC200405

Issued Date : 2004.04.01

Revised Date : 2006.01.19

Page No. : 12/12

H78XXAJ / BJ, H78XXAI / BI, H78XXANE / BNE, H78XXAE / BE

HSMC Product Specification

Soldering Methods for HSMC’s Products

1. Storage environment: Temperature=10

oC~35oC Humidity=65%±15%

2. Reflow soldering of surface-mount devices

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Average ramp-up rate (T

L to TP)<3

oC/sec

Preheat

- Temperature Min (Ts

min)

- Temperature Max (Ts

max)

- Time (min to max) (ts)

100

150

60~120 sec

150

200

60~180 sec

Tsmax to T

- Ramp-up Rate

oC/sec

Time maintained above:

- Temperature (T

- Time (t

183

60~150 sec

217

60~150 sec

Peak Temperature (T

240

oC +0/-5oC

260

oC +0/-5oC

Time within 5

oC of actual Peak

Temperature (t

10~30 sec

20~40 sec

Ramp-down Rate

oC/sec

Time 25

oC to Peak Temperature

<6 minutes

<8 minutes

3. Flow (wave) soldering (solder dipping)

Products

Peak temperature

Dipping time

Pb devices.

245

±5oC

10sec

±1sec

Pb-Free devices.

260

±5oC

10sec

±1sec

Figure 1: Temperature profile

Ramp-down

Ramp-up

Tsmax

Tsmin

Critical Zone

TL to TP

Preheat

t 25oC to Peak

Time

H7809AI Datasheet(PDF) 12 Page - Hi-Sincerity Mocroelectronics

H7809AI Datasheet(HTML) 12 Page - Hi-Sincerity Mocroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12

Datasheet Download

Link URL