DF15 datasheet(11/11 Pages) ETC1

11 / 11 page

A296

1. Recommended Temperature Profile (SMT)

2. Recommended Manual Soldering Condition (SMT)

3. Recommended Screen Thickness (SMT)

4. Board Warp (SMT)

5. Cleaning Condition

6. Cautions

Note1: Maximum twice action is allowed under the same condition. However, the interval between

the first process and second actions must be maintained at the room temperature.

Note2: The temperature indicates the board surface temperature in the connector lead area.

Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds

0.15mm

Max 0.03mm in the connector center area, based on the both connector edges

Refer to the "Nylon Connector Use Hand book".

sThe receptacle is designed in a structure where contacts are exposed. Touching it with bare

hands would cause contact failure or electrostatic element damage.

sWhere no board is mounted, the insertion or extraction will cause damage or deformation in the contacts.

sAvoid retaining the board with the connector only, and fix the board by any other means than the connector.

sExcessive scoop insertion or extraction may result in damage.

sIn the manual soldering process, don't carry out the flux coating which will cause a flux blister on the connector.

sThe color phase of this product may be slightly different from that of the formed product

according to the manufacturing lot. However, the difference doesn't affect the performance.

BPrecautions

DF15 Datasheet(PDF) 11 Page - List of Unclassifed Manufacturers