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Disclaimer

Please note that the above information is subject to change without notice.

QSFP DD Connectors

MATERIAL

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Housing: Black color, glass reinforced, lead free

solder reflow process compatible thermo plastic

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Contacts base material: High performance

copper alloy

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Plating solder tails: Matte tin

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Plating mating area: Gold

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Resonance dampening feature: Conductive

polymer

MECHANICAL PERFORMANCE

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Durability: 100 mating cycles

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Mating Force: 90N max.

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PCB thickness (Cage): 1.44mm min. for

singlemounted (1xN)

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Belly to belly (Cage): 2.35mm min. for 1xN

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Unmating force (Cage): 50N max.

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Insertion force to PCB (Cage):

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780N for 1x1 port

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1000N for 1x2 Ports

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1700N for 1x4 Ports

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2400N for 1x6 Ports

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3000N for 2x1 Ports

ELECTRICAL PERFORMANCE

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Operating Voltage: 30VDC per contact

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Operating Current: 0.5A per signal contact

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Differential Impedance: 100Ω +/- 10Ω

ENVIRONMENTAL

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Operating and storage temperature: -40° to +85°C

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RoHS & halogen free

TOOLING INFORMATION

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Cage mounting: Thru bezel

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EMI options: Spring fingers

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Configurations:

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1XN (N=1,2,3,4,5,6)

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2XN (N=1,2)

TARGET MARKETS/APPLICATIONS

Cellular infrastructure

Network Interface Cards

SAN-Storage Attached Networks

Hubs

Switch

Servers

Test and Measurement Equipment

TECHNICAL INFORMATION

PART NUMBER SELECTOR

Number of Ports in row

1

NX1

UE36

A

1

0

X

0

X

0

0

0

T

Heat Sink

0

Standard/None

Cage Plating

0

Standard

Heat Sink Height

0

Standard/None

Plating for Mating Contact

2

0.76µm (30µin) min gold , (GXT)

3

0.76µm (30µin) min gold

6

0.38µm (15µin) min gold

EMI Type

0 Standard

Termination

1 SMT

7 SMT with solder rings

Light Pipe Option

0 Standard, No light pipe

Style

A

1 X N SMT connector

Packaging

T

Tape and Reel

QSFP DD - Connector