CMP-Q Series High Power Anti-Surge Chip Resistors

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

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Performance Characteristics

Test Item

Method

Procedure

Test Limits DR

Electrical

Characteristics

AEC-Q200 Table 7.1

Measure the resistance value

DC Resistance:

F: ±1 % : J : ±5 %

TCR: Within specifications

High Temperature

Exposure (Storage)

AEC-Q200 Table 7.3

1000 hours @ T = 125 °C unpowered;

Measurement at 24 ±2 hours after test conclusion

J: ∆ R ≤ ±(3 % + 0.1 Ω)

F: ∆ R ≤ ±(1 % + 0.05 Ω)

Temperature Cycling AEC-Q200 Table 7.4

1000 cycles (-55 °C to +125 °C);

Measurement at 24 ±2 hours after test conclusion

J: ∆ R ≤ ±(1 % + 0.1 Ω)

F: ∆ R ≤ ±(0.5 % + 0.05 Ω)

No mechanical damage

Moisture Resistance AEC-Q200 Table 7.6

Test 65 °C / 80-100 % RH / 10 cycles;

Measurement at 24 ±2 hours after test conclusion

(t = 24 hours/cycle)

J: ∆ R ≤ ±(1 % + 0.1 Ω)

F: ∆ R ≤ ±(0.5 % + 0.05 Ω)

Biased Humidity

AEC-Q200 Table 7.7

1000 hours 85 °C / 85 % RH, 10 % of operating power;

Measurement at 24 ±2 hours after test conclusion

J: ∆ R ≤ ±(3 % + 0.1 Ω)

F: ∆ R ≤ ±(1 % + 0.05 Ω)

Operational Life

AEC-Q200 Table 7.8

Test 1000 hours @ TA = 125 °C at specified rated power;

Measurement at 24 ±2 hours after test conclusion

J: ∆ R ≤ ±(3 % + 0.1 Ω)

F: ∆ R ≤ ±(1 % + 0.05 Ω)

Mechanical Shock

AEC-Q200 Table 7.13

Test peak value: 100 g’s, wave: hail-sine;

Duration: 6 ms, Velocity: 12.3 ft/sec.

Within product specification

tolerance and no visible

damage

Vibration

AEC-Q200 Table 7.14

5 g’s for 20 min., 12 cycles each of 3 orientations;

Test from 10-2000 Hz

J: ∆ R ≤ ±(1 % + 0.1 Ω)

F: ∆ R ≤ ±(0.5 % + 0.05 Ω)

No mechanical damage

Resistance to Solder

Heat

AEC-Q200 Table 7.15

Solder dipping @ 270 °C ±5 °C for 10 sec. ±1 sec.

J: ∆ R ≤ ±(1 % + 0.1 Ω)

F: ∆ R ≤ ±(0.5 % + 0.05 Ω)

No mechanical damage

Thermal Shock

AEC-Q200 Table 7.16

-55 to 155 °C / dwell time 15 min /

max transfer time 20 sec / 300 cycles

J: ∆ R ≤ ±(1 % + 0.1 Ω)

F: ∆ R ≤ ±(0.5 % + 0.05 Ω)

No mechanical damage

ESD

AEC-Q200-002

Test contact min. 1 kV

∆ R ≤ ±(1 % + 0.1 Ω)

Solderability

AEC-Q200 Table 7.18

a) Baking 155 °C 4H, dipping 235 °C 5 sec

b) Steam 8H, dipping 215 °C 5 sec

c) Steam 8H, dipping 260 °C 7 sec

Over 95 % of termination

must be covered with solder

Flammability

AEC-Q200 Table 7.20

UL-94 V-0 or V-1 are acceptable

Refer UL-94

Board Flex

AEC-Q200 Table 7.21

Bending 2 mm (2512Q, 1206Q),

3 mm (0805Q, 0603Q)

J: ∆ R ≤ ±(1 % + 0.1 Ω)

F: ∆ R ≤ ±(0.5 % + 0.05 Ω)

No mechanical damage

Terminal Strength

AEC-Q200 Table 7.22

Force 1.8 Kg for 60 sec

No mechanical damage