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MCT8317A Datasheet(PDF) 157 Page - Texas Instruments |
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MCT8317A Datasheet(HTML) 157 Page - Texas Instruments |
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157 / 161 page  www.ti.com PACKAGE OUTLINE C 36X 0.25 0.15 2.8 2.6 36X 0.5 0.3 0.8 MAX (0.1) TYP 0.05 0.00 32X 0.4 2X 3.6 3.8 3.6 2X 2.8 4X (0.41) A 4.1 3.9 B 5.1 4.9 WQFN - 0.8 mm max height REE0036A PLASTIC QUAD FLATPACK - NO LEAD 4226725/A 04/2021 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 10 19 28 11 18 36 29 PIN 1 ID 0.1 C A B 0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SYMM SYMM SCALE 3.300 www.ti.com MCT8317A SLLSFQ2 – JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 157 Product Folder Links: MCT8317A |
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