Integrated Silicon Solution, Inc.

PACKAGING INFORMATION

Thin Shrink Small Outline TSSOP

Package Code: Z (8 pin, 14 pin)

Rev B 02/01/02

TSSOP (Z)

Ref. Std.

JEDEC MO-153

No. Leads

8

Millimeters

Inches

Symbol Min

Max

Min

Max

A

—

1.20

—

0.047

A1

0.05

0.15

0.002 0.006

A2

0.80

1.05

0.032 0.041

B

0.19

0.30

0.007 0.012

C

0.09

0.20

0.004 0.008

D

2.90

3.10

0.114 0.122

E1

4.30

4.50

0.169 0.177

E

6.40 BSC

0.252 BSC

e

0.65 BSC

0.026 BSC

L

0.45

0.75

0.018 0.030

α

—8°

—

8°

TSSOP (Z)

Ref. Std.

JEDEC MO-153

No. Leads

14

Millimeters

Inches

Symbol Min

Max

Min

Max

A

—

1.20

—

0.047

A1

0.05

0.15

0.002

0.006

A2

0.80

1.05

0.031

0.041

B

0.19

0.30

0.007

0.012

C

0.09

0.20

0.0035 0.008

D

4.90

5.10

0.193

0.201

E1

4.30

4.50

0.170

0.177

E

6.40 BSC

0.252 BSC

e

0.65 BSC

0.026 BSC

L

0.45

0.75

0.0177 0.0295

α

—8°

—

8°

D

B

e

E1

A2

E

C

A

A1

L

α

1

N

N/2

SSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may

appear in this publication. © Copyright 2002, Integrated Silicon Solution, Inc.