ADL6337ACRZB-R7 datasheet(26/41 Pages) AD

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Data Sheet

ADL6337

BASIC CONNECTIONS

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Rev. B | 26 of 41

Figure 67. Basic Connections

Table 18. Basic Connections

Functional Blocks

Pin No.

Mnemonic

Description

Basic Connection

5 V

11, 14

V50AMP1, V50AMP2

Amplifiers, analog supply voltage, 5 V

Decouple this pin via 10 pF, 0.1 µF

capacitors to ground. Ensure that the

decoupling capacitors are located close to

the pin.

Fast Attenuation

10, 9

ATTSEL1, ATTSEL2

Fast attenuation selection

RF Input

4, 5

RFIN_P, RFIN_N

RF inputs

Differential RF input.

RF Output

RFOUT

RF output, single-ended.

Serial Port

Active-low chip select

1.8 V to 3.3 V tolerant logic levels.

SCLK

SPI clock

1.8 V to 3.3 V tolerant logic levels.

SDO

SPI data input

1.8 V to 3.3 V tolerant logic levels.

SDIO

SPI data output

1.8 V to 3.3 V tolerant logic levels.

V50BIAS

Bias circuitry power supply (5.0 V)

Decouple this pin via 10 pF, 0.1 µF

capacitors to ground. Ensure that the

decoupling capacitors are located close to

the pin.

Chip Selection

29, 30, 31

CS_A2, CS_A1, CS_A0 SPI chip select (see the Configuring Multiple

Chips to Share the SPI Bus section for

information about the connections in a multiple

chip operation; ground these pins if unused)

Chip selection.

Device Enable

TXENP

Active high for normal operation

Ground

3, 6, 12, 13, 18, 19, 20, 22,

GND

Ground

Connect these pins to the ground of the

printed circuit board.

EPAD

Exposed pad

Exposed Pad 1. The exposed pad must

be connected to ground for electrical and

thermal purposes.

NIC

2, 7, 8, 15, 16, 17, 28

NIC

No internal connection. These pins have

no physical connection within the chip.

They can be grounded or floated.

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