Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Electrical Characteristics

Max. Time

Tripped

Ihold

Itrip

To Trip

Power

Resistance

Dissipation

Model

Amperes

Ohms

Amperes

Seconds

Watts

V max.

I max.

at 23 °C

at 23 °C

at 23 °C

at 23 °C

at 23 °C

Volts

Amps

Hold

Trip

RMin.

R1Max.

Typ.

MF-MSMD010

60.0

40

0.10

0.30

0.70

15.00

0.5

1.5

1.0

MF-MSMD014

60.0

40

0.14

0.34

0.40

6.50

1.5

0.15

1.0

MF-MSMD020

30.0

80

0.20

0.40

0.40

6.00

6.0

0.06

1.0

MF-MSMD030

30.0

10

0.30

0.60

0.30

3.00

8.0

0.10

1.2

MF-MSMD050

15.0

100

0.50

1.00

0.15

1.00

8.0

0.15

1.2

MF-MSMD075

13.2

100

0.75

1.50

0.11

0.45

8.0

0.20

1.2

MF-MSMD110

6.0

100

1.10

2.20

0.04

0.21

8.0

0.30

1.2

MF-MSMD125

6.0

100

1.25

2.50

0.035

0.14

8.0

0.4

1.5

MF-MSMD150

6.0

100

1.50

3.00

0.03

0.120

8.0

0.5

1.5

MF-MSMD160

8.0

100

1.60

2.80

0.035

0.099

8.0

2.0

1.5

MF-MSMD200

6.0

100

2.00

4.00

0.020

0.100

8.0

3.0

1.5

MF-MSMD260

6.0

100

2.60

5.20

0.015

0.080

8.0

5.0

1.5

Operating/Storage Temperature ........................-40 °C to +85 °C

Maximum Device Surface Temperature

in Tripped State ................................................125 °C

Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change

Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours....................±5 % typical resistance change

Thermal Shock ....................................................+85 °C to -40 °C, 20 times ..........................±10 % typical resistance change

Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change

Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change

Condition A

Environmental Characteristics

Test

Test Conditions

Accept/Reject Criteria

Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description

Resistance ......................................In still air @ 23 °C ............................................................Rmin ≤ R ≤ R1max

Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤ max. time to trip (seconds)

Hold Current....................................30 min. at Ihold ..............................................................No trip

Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning

Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning

Solderability ....................................MIL-STD-202F, Method 208F..........................................95 % min. coverage

UL File Number ..................................E174545

http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545

CSA File Number ................................CA110338

http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000

TÜV Certificate Number......................R 02057213

http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213

Test Procedures And Requirements For Model MF-MSMD Series

Features

assembly

Applications

High Density Circuit Board Applications:

TV Rheinland