•

112 Gbps PAM4 per channel

•

112 fully shielded differential pairs per square inch

•

4.0 Tbps aggregate data rate - 9 IEEE, 400 G channels

•

Extremely low crosstalk to 40 GHz+

•

Incredibly tight impedance control

•

Minimal variance in data rate as stack height increases

•

40% less space vs traditional arrays with the same data throughout

KEY SPECIFICATIONS

FEATURES & BENEFITS

STACK

HEIGHTS

TOTAL PAIRS

INSULATOR

MATERIAL

CONTACT

MATERIAL

PLATING

CURRENT

RATING

WORKING

VOLTAGE

LEAD-FREE

SOLDERABLE

7 mm, 9 mm,

10 mm & 12 mm

Up to

32 pairs

Black LCP

Copper Alloy

Au or Sn over

50 µ" (1.27 µm) Ni

2.1 A per pin

(signal)

9.6 A per pin

(ground)

200 VAC

Yes

EXTREME PERFORMANCE

HIGH-DENSITY ARRAYS

(0.80 mm) .0315" x (1.80 mm) .071" PITCH

®

High-speed mezzanine

connector and cable in

one product family

BGA attach to board

for greater density and

optimized trace

breakout region

Guaranteed two points

of contact to ensure a

more reliable connection

Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.

F-221 (Rev 09MAR22)

samtec.com/NovaRay