6.7 Thermal Information for LM2901B-Q1

THERMAL METRIC(1)

LM2901B-Q1

UNIT

D

(SOIC)

PW

(TSSOP)

DDY

(SOT-23)

RTE

(QFN)

RUC

(X2QFN)

14 PINS

14 PINS

14 PINS

16 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

111.2

136.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

66.9

66.6

RθJB

Junction-to-board thermal resistance

67.8

79.8

ψJT

Junction-to-top characterization parameter

28.0

17.8

ψJB

Junction-to-board characterization parameter

67.4

79.3

RθJC(bot)

Junction-to-case (bottom) thermal resistance

-

-

-

-

(1)

For more information about traditional and new thermal metrics, see the Semicondctor and IC Package Thermal Metrics report,

SPRA953.

6.8 Thermal Information for LM2901x-Q1

THERMAL METRIC(1)

LM2901x-Q1

UNIT

D

(SOIC)

PW

(TSSOP)

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance(2)

88.6

119.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

49.1

47.9

°C/W

RθJB

Junction-to-board thermal resistance

43.0

60.9

°C/W

ψJT

Junction-to-top characterization parameter

13.6

5.4

°C/W

ψJB

Junction-to-board characterization parameter

42.7

60.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semicondctor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) − TA) / RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

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LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1

SLCS142G – DECEMBER 2003 – REVISED MARCH 2023

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Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1