OPA828ID datasheet(32/47 Pages) TI

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8.4.1.2 PowerPAD™ Design Considerations (DGN package only)

The OPAx828 are available in a thermally-enhanced, PowerPAD integrated circuit package. Figure 8-9(a) and

(b) illustrate how the PowerPAD packages are constructed using a downset leadframe upon which the die is

mounted. Figure 8-9(c) shows how this arrangement results in the leadframe being exposed as a thermal pad

on the underside of the package. This thermal pad has direct thermal contact with the die. Therefore, excellent

thermal performance is achieved by providing a good thermal path away from the thermal pad.

DIE

Thermal

Pad

(a)SideView

(b)EndView

(c)BottomView

Figure 8-9. Views of the Thermally-Enhanced Package

The PowerPAD integrated circuit package allows for both assembly and thermal management in one

manufacturing operation. During the surface-mount solder operation (when the leads are being soldered),

the thermal pad must be soldered to a copper area underneath the package. Through the use of thermal

paths within this copper area, heat is conducted away from the package into either a ground plane or other

heat-dissipating device. Soldering the thermal pad to the printed circuit board (PCB) is always required, even

with applications that have low power dissipation. This soldering provides the necessary thermal and mechanical

connection between the leadframe die pad and the PCB. Although the die is electrically isolated (>10 MΩ) from

the exposed thermal pad, tie the pad to V– or a system ground plane to minimize potential leakage to the input

pins. See Figure 8-11 for additional details.

OPA828, OPA2828

SBOS671D – SEPTEMBER 2018 – REVISED DECEMBER 2022

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OPA828ID Datasheet(PDF) 32 Page - Texas Instruments