STM32F103CBU6XXX datasheet(76/116 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32F103x8, STM32F103xB

76/116

DS5319 Rev 18

Figure 37. ADC accuracy characteristics

Table 49. ADC accuracy(1) (2) (3)

1. ADC DC accuracy values are measured after internal calibration.

2. Better performance can be achieved in restricted VDD, frequency and temperature ranges.

3. Injecting a negative current on any analog input pins should be avoided as this significantly reduces the

accuracy of the conversion being performed on another analog input. It is recommended to add a Schottky

diode (pin to ground) to standard analog pins which may potentially inject negative current.



Any positive injection current within the limits specified for IINJ(PIN) and IINJ(PIN) in Section 5.3.12 does not

affect the ADC accuracy.

Symbol

Parameter

Test conditions

Typ

Max(4)

4. Evaluated by characterization, not tested in production, unless otherwise specified.

Unit

Total unadjusted error

fPCLK2 = 56 MHz,

fADC = 14 MHz, RAIN < 10 kΩ,

VDDA = 2.4 V to 3.6 V

Measurements made after

ADC calibration

±2

±5

LSB

Offset error

±1.5

±2.5

Gain error

±1.5

±3

Differential linearity error

±1

±2

Integral linearity error

±1.5

±3

MSv19880V6

(1) Example of an actual transfer curve

(2) Ideal transfer curve

(3) End-point correlation line

n = ADC resolution

ET = total unadjusted error: maximum deviation

between the actual and ideal transfer curves

EO = offset error: maximum deviation between the first

actual transition and the first ideal one

EG = gain error: deviation between the last ideal

transition and the last actual one

ED = differential linearity error: maximum deviation

between actual steps and the ideal one

EL = integral linearity error: maximum deviation between

any actual transition and the end point correlation line

n-1

Output code

VSSA

n-2

n-3

VREF+ (VDDA)

1 LSB ideal

(1)

(2)

(3)

(or

)]

[1LSB =

VDDA

VREF+

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